APPARATUS AND METHOD OF DEPOSITING FILMS USING BIAS

摘要

A method for depositing films using bias is provided to separately control deposition behavior by applying a bias to a substrate in consideration of charged behavior of charged nano-particles. A substrate is loaded in a chamber(15), and a gas supply system(20) is adapted to introduce a reaction gas into the chamber. A filament(30) is adapted to emit heat for dissociating the introduced reaction gas, and a power supply(70) is adapted to supply a constant alternate current or direct current voltage. A bias supply unit(80) is adapted to apply a bias to at least one of a top, a side and a bottom of the substrate using the voltage applied from the power supply while a film is deposited on the substrate from the dissociated reaction gas. The bias supply unit is separated from the substrate.