发明名称 Cooling method and device for an electronic component
摘要 A cooling device for electronic components has a main body, a motor, an adaptor tube, a shaft, a valve assembly, a reservoir, and a delivery tube. The motor is mounted in the main body. The adaptor tube is mounted between the main body and the reservoir and is gradually smaller in diameter from the main body to the reservoir. The shaft connects to the motor, extends into the adaptor tube and has multiple fan blades corresponding to the inside diameter of the adaptor tube. The fan blades blow the air through the adaptor tube into the reservoir to pressurize the air. The pressurized air flows through the delivery tube to contact the electronic component and equalizes to correspond to the atmosphere. The equalizing process of the pressurized air absorbs heat from the electronic component as it expands to cool the electronic component.
申请公布号 US7342784(B2) 申请公布日期 2008.03.11
申请号 US20060439282 申请日期 2006.05.24
申请人 CIMAKER TECHNOLOGY CO., LTD. 发明人 TSENG KENG-WEN
分类号 H05K7/20;F25D9/00;F25D23/12 主分类号 H05K7/20
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