| 摘要 |
A digital camera module package method includes the steps of: firstly, providing a carrier ( 30 ), which includes a base ( 24 ) and a leadframe ( 320 ). The base has a cavity therein and the leadframe includes a number of conductive pieces ( 322 ); Secondly, mounting an image sensor chip ( 34 ) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires ( 36 ), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means ( 3262 ) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover ( 38 ) on the carrier, where an adhesive means fixes the cover in place.
|
