| 摘要 |
<p>A wafer chuck cleaning device for semiconductor exposure equipment is provided to prevent a reference position of a wafer stage from being misaligned by dropping particles existing on wafer chuck pins between the wafer chuck pins. A table(140) takes over a wafer from a transfer robot, and vacuum sucks up the wafer. A particle removing bar(152) drops particles of a wafer chuck mounted on the table between chuck pins to vacuum suck up the particles. A moving member(158) moves the particle removing bar in left and right directions. The moving member is connected to the particle removing bar by a connecting member(156). An up/down cylinder(160) is provided on the upper portion of the moving member to move the moving member up and down.</p> |
