ELECTRO COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

An electronic component package and a method for manufacturing the same are provided to prevent generation of an air gap of an adhesive and to stabilize a handling operation by supplying sound pressure to one side of a cavity and injecting the adhesive into the other side of the cavity. An electronic component is mounted on one surface of a first insulating layer(S110). A heat-radiating plate having a cavity corresponding to an electronic component is bonded on one side of the first insulating layer to cover the electronic component(S120). The cavity is filled with an adhesive(S130). A circuit pattern is formed on the other side of the first insulating layer(S140). The heat-radiating plate includes an injection hole and an absorbing hole. The adhesive is injected through the injection hole to the cavity. The absorbing hole is used for supplying sound pressure to the cavity.