| 摘要 |
An electronic component module is provided to improve the performance of the whole module by constraining an induction current loss and a high frequency resistance, and constraining a wire distribution loss. An electronic component module includes a wire distribution substrate, a passive component group(20), and at least one device chip(41,42). The passive component group includes a plurality of passive components(21,22) formed on the wire distribution substrate. The device chip is mounted on the wire distribution substrate. A plurality of passive components include a multi-step coil inductor formed on the wire distribution substrate. The multi-step coil inductor has a plurality of coils which are arranged in a multi-step. A coil conducting line which is neighboring to the multi-step coil is separated to have an aperture. |
