| 摘要 |
Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms is provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer (18) is employed proximate to the organic electronic device (14). Alternatively, a metal alloy sealant layer (18) in combination with primer layer (22, 24) may also be implemented. Further, superstates (20) and edge wraps may be provided to completely surround the organic electronic device. ® KIPO & WIPO 2008 |
