| 摘要 |
A substrate processing apparatus is provided to remove a film formed on a circumference of a substrate by rotating the substrate and supplying a remover to the circumference of the rotating substrate. A processing unit processes a substrate(W). An input/output unit is installed at one end of the processing unit in order to input the substrate or output the substrate between the processing unit and an exposure apparatus. The processing unit includes a film forming unit for forming a film on a surface of the substrate before an exposure process. The film forming unit includes a substrate supporting device for supporting the substrate in a horizontal state, a rotation driver for rotating the substrate around a perpendicular shaft, a film forming device for forming a film by supplying a coating solution on the rotating substrate, a removal device for removing a ring-shaped region from a circumference of the film, and a position correction device for correcting a removal position of the circumference.
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