| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing device capable of treating a work finely by concentrating plasma locally. <P>SOLUTION: The plasma processing device 1 includes a pair of electrodes 2, 3 installed mutually oppositely through a work 10, a power supply circuit 7 provided with a power supply 72, a gas supply means 8 to supply a treating gas, a treating gas injection part 5 which is formed along circumference direction on the outer circumference side of a line 20 connecting center parts of each electrodes 2, 3, and a treating gas supply passage 6 which introduces the treating gas supplied from the gas supply means 8 to the treating gas injection part 5. The treating gas injected from the treating gas injection part 5 flows in a direction going to the line 20 and in a direction separating from the line 20, and by applying voltage on the pair of electrodes 2, 3, the treating gas is activated to generate plasma, and the treating surface 101 of the work 10 is treated by the plasma. <P>COPYRIGHT: (C)2008,JPO&INPIT |
