发明名称 METHOD FOR MOUNTING ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts which can mount electronic parts in a high workability and at a high speed on a board by using a mounting apparatus for a plurality of electronic parts. <P>SOLUTION: The method for mounting electronic parts is configured such that while a head section 30 is moved in the X direction and the Y direction by XY table mechanisms 12, 13 disposed above a conveying path 11 of a board 8, electronic parts P in a parts feeder 21 provided side-by-side at an electronic part feeding section 20 provided on the side of the conveying path 11 of the board 8 are vacuum-sucked and picked up to the lower end of nozzles 31 of the head section 30 and moved to and mounted on the board 8. An interval "a" between two adjacent nozzles 31 of the head section 30 on which a plurality of the nozzles 31 to vacuum-suck the electronic parts P are arranged in a circle form and an arranging pitch "a" of the electronic parts P in the parts feeder 21 are made equal, whereby two adjacent electronic parts P in the parts feeder 21 are simultaneously picked up by two adjacent nozzles 31 of the head section 30. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053750(A) 申请公布日期 2008.03.06
申请号 JP20070288380 申请日期 2007.11.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIDESE WATARU
分类号 H05K13/04 主分类号 H05K13/04
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