| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a module to be disposed in mounting a semiconductor chip on a ceramic substrate, and a manufacturing module of a camera module. <P>SOLUTION: An adhesive film 3 is pasted on a metal plate 1 having a plurality of openings formed thereon, and a module-size ceramic substrate 5 is fixed on the adhesive surface exposed from the opening 2, thereby manufacturing a semiconductor substrate. With this method, the only thing to do in a final process is to vacuum-adsorb the semiconductor substrate. A supporting member can be repeatedly used, and the wasteful use of the ceramic substrate to be cut in a conventional method can be eliminated. Further, the number of devices per sheet of supporting member can increase. Since the divided step of the ceramic in the manufacturing process is eliminated, yield can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
