| 摘要 |
PROBLEM TO BE SOLVED: To uniformly and efficiently supply an electric power into a chip, while securing wiring resources. SOLUTION: A semiconductor device includes: a plurality of power source pads 17a; a plurality of ground pads 18a alternately arranged with the power source pads 17a in an X direction; first upper layer power source wirings 17b existing by extension in the X direction and connected to the first ends of the respective power source pads 17a in the X direction; first upper layer ground wirings 18b existing by extension in the X direction and connected to the second ends at the opposite side of the first ends of the respective ground pads 18a in the X direction; second upper layer power source wirings 17c arranged by extension to the neighborhood of the adjacent ground pads 18a from the power source pads 17a between the first upper layer power source wirings 17b and the first upper layer ground wirings 18b; and second upper layer ground wirings 18c existing by extension to the neighborhood of the adjacent power source pads 17a from the ground pads 18a between the first upper layer power source wirings 17b and the first upper layer ground wirings 18b. The formation of 17a, 17b, 17c, 18a, 18b, 18c is attained on the same pad layer. COPYRIGHT: (C)2008,JPO&INPIT
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