发明名称 BACK ELECTRON IMPACT HEATING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent breakage of an apparatus by avoiding generation of spark discharge. SOLUTION: This back electron impact heating device includes: a filament 9 arranged behind a heating plate 2 used as a top plate of a heating vessel 1; a heating power source 12 heating the filament 9; an acceleration power source 7 applying an acceleration voltage to the filament 9; and a temperature measurement means measuring the temperature of the heating plate 2. The device is provided with a switching circuit which is structured such that, when the heating plate 2 is heated by carrying a current to the filament 9 from the heating power source 12, the acceleration power source 7 is separated from the filament 9 until the temperature of the heating plate 2 measured by the temperature measurement means reaches a certain set value, and the heating plate 2 is heated only by carrying the current to the filament 9 from the heating power source 12; and, when the temperature of the heating plate 2 measured by the temperature measurement means exceeds the set value, the device is switched over to apply the acceleration voltage to the filament 9 by the acceleration power source 7. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053028(A) 申请公布日期 2008.03.06
申请号 JP20060227540 申请日期 2006.08.24
申请人 SUKEGAWA ELECTRIC CO LTD 发明人 HAGA SHIGETAKA;MIURA KUNIAKI
分类号 H05B7/00;H01L21/02;H05B3/74 主分类号 H05B7/00
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