| 摘要 |
PROBLEM TO BE SOLVED: To realize vapor deposition in which oblique vapor deposition and the reduction of a vapor deposition rate are prevented by a compact system. SOLUTION: The vacuum deposition system is provided with: an evaporation source; a substrate holder oppositely arranged in the upper part of the evaporation source, and provided so as to support a semiconductor substrate and be step-movable in a plane; and a sticking prevention mask fixedly arranged between the substrate holder and the evaporation source and exposing a part of the semiconductor supported by the substrate to the evaporation source. COPYRIGHT: (C)2008,JPO&INPIT
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