| 摘要 |
PROBLEM TO BE SOLVED: To provide an unsaturated polyester resin composition for sealing excellent in solder reflowing properties. SOLUTION: The invention relates to the unsaturated polyester resin composition for sealing comprising 100 pts.wt. of the unsaturated polyester resin composed of an unsaturated polyester resin and a diallyl phthalate resin with a weight ratio of the former/the latter=90/10 to 70/30, 170-250 pts.wt. of an inorganic filler, 30-80 pts.wt. of glass fibers, wherein more than 50 wt.% of the unsaturated polyester resin is obtained by carrying out a condensation reaction of isophthalic acid. COPYRIGHT: (C)2008,JPO&INPIT
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