发明名称 BASE MATERIAL FOR HEAT ADHESION AND PREFORM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a base material for heat adhesion, which has excellent adhesiveness, processing property and excellent hot melt adhesiveness to various members, particularly to a polycarbonate resin member; and also to provide a preform using the material. SOLUTION: The base material comprises a thermoplastic resin composition containing one or more kinds of polyester resins including a polyester resin having a melting point Tm of 120°C≤Tm≤180°C, a melt viscosityη1 of 500≤η1≤2,000 Pa s on a parallel plate of 20 mm diameter at a temperature of (Tm+10)°C and a generated torque of 0.005J, wherein the basis weight is 5-100 g/m<SP>2</SP>. The base material is used for the adhesion of members including a polyester resin or a polycarbonate resin. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008050597(A) 申请公布日期 2008.03.06
申请号 JP20070195508 申请日期 2007.07.27
申请人 TORAY IND INC 发明人 TSUCHIYA ATSUKI;HONMA MASATO
分类号 C09J167/00;B29B11/16;C08J5/12;C09J7/00;C09J7/04;C09J163/00 主分类号 C09J167/00
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