Microchip package for electronic assembly e.g. printed circuit board, has interposer with segmented apertures mounted on microchip device

摘要

The microchip package has an interposer (7) mounted on a microchip device (1). An aperture (11) having a sidewall defining an opening through the interposer allows a connection of the electrical contacts on the top surface of the microchip device to the electrical contacts on the top surface of the interposer. A tie-bar (19) fixed to the sidewall divides the aperture into two portions, in which the depth of the tie-bar in the aperture is around two-thirds of the depth of the aperture through the interposer.