发明名称 COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure, having good energy efficiency and not creating a factor of disturbance to an apparatus. SOLUTION: This cooling structure for cooling heat emitted from the apparatus 2 disposed in a production room 1 to the outside of the apparatus 2, includes: cooling panels 10, which are disposed in a temperature adjusting area 3 demarcating space above and side of the apparatus 2 from the outside, and in a space above the top face of the apparatus 2 and also except the vertical upside of the apparatus 2 to cool heat emitted from the apparatus 2 to the outside of the apparatus 2; a heat reservoir space part 20 formed in the space above the top face of the apparatus 2 in the temperature adjusting area 3 to stay the air heated by heat emitted from the apparatus 2; and a convection space part 30 formed on the side of the apparatus 2 in the temperature adjusting area 3 to allow the natural convection of air cooled by the cooling panels 10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008051394(A) 申请公布日期 2008.03.06
申请号 JP20060227541 申请日期 2006.08.24
申请人 TAKENAKA KOMUTEN CO LTD 发明人 WADA KAZUKI;TAKAHASHI MIKIO;HIGUCHI YOSHIAKI;ISHIGURO TAKESHI;SAKATA MINORU
分类号 F24F5/00;F24F11/02;F25D9/00 主分类号 F24F5/00
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