| 摘要 |
PROBLEM TO BE SOLVED: To improve manufacturing efficiency by simplifying a manufacturing process. SOLUTION: A semiconductor element comprises: a first substrate 100 where a capacitor cell 111 is formed; a second substrate 200 where a circuit section having transistors and wiring is formed; and a connection electrode 300 for electrically connecting the capacitor cell 111 to the circuit section. COPYRIGHT: (C)2008,JPO&INPIT |
