| 摘要 |
A carrier board structure with semiconductor chip embedded therein is proposed. The carrier board structure includes a carrier board having a first surface and a second surface opposed to the first surface, wherein the carrier board including at least one cavity having a chamfer. A semiconductor chip can be easily disposed in the cavity by the chamfer, and an adhesion material can be evenly filled in the cavity by the chamfer, so as to avoid generating air bubbles, voids and reduce stress.
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