ELECTRONIC COMPONENT TAKING OUT APPARATUS, SURFACE MOUNTING APPARATUS AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT

摘要

A plurality of previously marked reference electronic components (M1, M2) are identified and recognized, and the position of an electronic component (2a) to be taken out is calculated, based on the positions of the reference electronic components (M1, M2) positioned close to the electronic component (2a) to be taken out and the component arrangement information of a wafer mapping file (MF) stored in a storage means (11f).