| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly transparent sealant for an optical semiconductor element capable of being high in heat resistance, light resistance and adhesiveness, not easily causing the sticking of dust and damages since the surface tucking property of a cured object is sufficiently suppressed, suppressing volume reduction due to the volatilization of acid anhydride, and obtaining a highly reliable optical semiconductor device; and to provide the optical semiconductor device. <P>SOLUTION: The sealant for the optical semiconductor element contains a silicone resin which has at least one epoxy containing group within a molecule, the acid anhydride, and a surfactant. <P>COPYRIGHT: (C)2008,JPO&INPIT |
