| 摘要 |
The present invention discloses a small-pitch three-dimensional mask-programmable memory (SP-3DmM). It is an ultra-low-cost and ultra-high-density semiconductor memory. SP-3DmM comprises a mask-programmable memory level stacked above the substrate. This memory level comprises diodes but no transistors or antifuses. Its minimum line pitch is smaller than the minimum gate pitch of the substrate transistors.
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