| 摘要 |
A reviewing apparatus using a SEM and a method for reviewing defect according to the present invention includes the steps of: correcting alignment errors of coordinates of the large number of defect candidates output by the inspection apparatus; selecting a detailed inspection/review point on the basis of the distance between coordinates of each of the large number of defect candidates whose alignment errors have been corrected and a point of interest such as a hot spot; performing imaging by use of a detailed inspection apparatus to acquire an image at the position, and to acquire an image in proximity to the position; determining, from the acquired image, a detailed coordinate position of the defect detected by inspection apparatus; and on the basis of the acquired image and detailed defect coordinate position, judging whether or not the selected defect is a defect that is important for the process control.
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