| 摘要 |
Disclosed herein are a thin printed circuit board, in which a pair of high-functional resin substrates having a permittivity ranging from 1.5 to 4.0, on one surface of each of which a circuit pattern is formed through ion-beam surface treatment, vapor deposition and electroplating, are layered with an insulating layer interposed therebetween, and a method of manufacturing the printed circuit board. The circuit patterns are positioned inside the substrates. Thereafter, external layers are formed through ion-beam surface treatment, vapor deposition and electroplating. According to the present invention, the adhesiveness between each of the substrates and a metal layer may be improved through the ion-beam surface treatment/vapor deposition. Furthermore, since the pair of resin substrates are layered with the insulating layer interposed therebetween, the circuit patterns may be disposed inside the pair of resin substrates, so that the total thickness of the substrate may be reduced, thereby realizing highly reliable fine circuits.
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