| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a board connector capable of increasing durability against a separation force from a board applied on the engagement face side of a housing. <P>SOLUTION: A solder filling part 25 is formed at a soldering part 22 by denting a front end part 22A upward, and solder adhered along the lower side of the soldering part 22 enters into the solder filling part 25 to be filled up. Thereby, the thickness (volume) of a solder layer H adhered to the front end part 26A of corners 26 increases and stress generated in this solder layer H becomes small. Thereby, breakage of the solder layer H due to a separation force from a board K applied on the front side (engagement face side) of the housing 10 is prevented, as a result, durability of the board connector 1 against the separation force is increased. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
