| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prober capable of accurately detecting the places of moving stages on an X-axis and a Y-axis even when the Y-axis and a base are deformed thermally when a wafer chuck is heated/cooled. <P>SOLUTION: The prober has the wafer chuck 16 with a built-in heating/cooling member, an X-axis stage 14 rotating the wafer chuck 16 and conducting movements in the Z-axis and X-axis directions, a Y-axis stage 13 conducting the movement in the Y-axis direction of the wafer chuck 16, and the base 12 moving and supporting the Y-axis stage 13. The prober is calibrated by linear scales 41 and 42 fitted in parallel with the vertical direction apart from the X-axis stage 13 on one side face of the direction that the X-axis stage 14 of the Y-axis stage 13 is moved, and an arm 40 with heads 43 and 44 fitted on the side face of the X-axis stage 14 and opposed to the linear scales 41 and 42, respectively. The prober corrects and detects the value of the linear scale 41 reading the place of the X-axis stage 14 by the reading of the linear scale 42. Such a prober is used. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
