发明名称 Controlled ambient system for interface engineering
摘要 A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.
申请公布号 US2008057221(A1) 申请公布日期 2008.03.06
申请号 US20060639752 申请日期 2006.12.15
申请人 LAM RESEARCH CORPORATION 发明人 BOYD JOHN;DORDI YEZDI;ARUNAGIRI TIRUCHIRAPALLI;MOORING BENJAMIN W.;PARKS JOHN;THIE WILLIAM;REDEKER FRITZ C.;HOWALD ARTHUR M.;SCHOEPP ALAN;HEMKER DAVID
分类号 H05H1/24;C23C16/00 主分类号 H05H1/24
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