| 摘要 |
A CMOS semiconductor device includes: an isolation region formed in the surface layer of a semiconductor substrate to define an NMOSFET active region and a PMOSFET active region adjacent to each other; an NMOSFET structure formed in the NMOSFET active region; a PMOSFET structure formed in the PMOSFET active region; a tensile stress film covering the NMOSFET structure; and a compressive stress film covering the PMOSFET structure, wherein a border between the tensile stress film and the compressive stress film is set nearer to the PMOSFET active region than the NMOSFET active region along a gate width direction. A performance of a CMOS semiconductor device can be improved by the layout of the tensile and compressive stress films.
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