发明名称 POLYMERIC COMPOUND, POSITIVE RESIST MATERIAL, AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a polymeric compound appropriate for a base resin of a positive resist material having a high resolution exceeding a conventional positive resist material, an excellent pattern shape after exposure, and further exhibiting excellent etching resistance, particularly of a chemically amplified positive resist material, a positive resist material and a pattern forming method using the same. <P>SOLUTION: The polymeric compound is characterized by having at least a repeating unit of a substitutable hydroxystyrene, and a repeating unit of a substitutable hydroxyvinylnaphthalene, represented by general formulae (1). <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008050568(A) 申请公布日期 2008.03.06
申请号 JP20070151308 申请日期 2007.06.07
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;TAKEDA TAKANOBU
分类号 C08F212/02;G03F7/039;H01L21/027 主分类号 C08F212/02
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