发明名称 THERMOCONDUCTIVE RESIN COMPOSITION AND USE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermoconductive resin composition giving moldings having high thermoconductivity and high mechanical strength, suitable as electric/electronic elements and of low cost. <P>SOLUTION: [1] A thermoconductive resin composition comprising ingredients (A) to (C) is provided. (A) A thermoplastic resin and/or a heat-curable resin, (B) a particulate having 0.5-5 mm number-average particle diameter and obtained by granulating fibers composed mainly of alumina having 1-50 &mu;m number-average fiber diameter and (C) alumina fine particles. [2] The thermoconductive resin composition of [1], whose ingredient (A) is liquid crystal polyester, is provided. [3] Moldings obtained by molding the thermoconductive resin composition [1] or [2] are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008050555(A) 申请公布日期 2008.03.06
申请号 JP20060302533 申请日期 2006.11.08
申请人 SUMITOMO CHEMICAL CO LTD 发明人 KOMATSU SHINTARO;MAEDA MITSUO;HARADA HIROSHI
分类号 C08L101/00;C08K7/24;C08L67/03;C08L81/02;C09K5/08 主分类号 C08L101/00
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