| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer printed wiring board incorporating a semiconductor element with high yield and low cost. <P>SOLUTION: The process for manufacturing a multilayer printed wiring board 1 comprises a step for mounting a semiconductor element 2 on each first piece size printed wiring board 44 of a first sheet size printed wiring board 10 having normal wiring patterns 12, 13 and 16, inspecting the semiconductor element 2 for abnormality, and putting a judgment mark 45 on the first piece size printed wiring board 44 mounting a semiconductor element 2 in which abnormality is detected; and a step for dividing a work size printed wiring board 46 where the semiconductor element 2 is incorporated in each first piece size printed wiring board 44 for every piece size multilayer printed wiring board 1, inspecting existence of the mark 45, and removing the piece size multilayer printed wiring board 1 in which the mark 45 is detected. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
