| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a semiconductor device having enhanced reliability can be provided with excellent mass productivity by reducing noise. <P>SOLUTION: The method for manufacturing an optical communication module includes a step of mounting a plurality of light emitting elements, light receiving elements and IC chips on a substrate material 11; a step of arranging a metal case 12 for shielding the IC chips above the light receiving elements and the IC chips; a step of resin sealing the light emitting elements, the light receiving elements, and the IC chips including the metal case 12 to form a resin package 8; and a step of cutting the substrate material 11 including the resin sealed metal case 12. <P>COPYRIGHT: (C)2008,JPO&INPIT |
