| 摘要 |
PROBLEM TO BE SOLVED: To save an application liquid in an application treatment for applying a resist liquid onto the upper surface of a wafer. SOLUTION: First, the wafer is held by a spin chuck (S1). Then, the wafer W is rotated (S2) and liquid nitrogen is supplied onto the surface of the rotated wafer (S3). The liquid nitrogen is supplied by moving a nozzle for cooling from the upper part of the outer periphery to the upper part of the center of the surface of the wafer, in a state where the liquid nitrogen is discharged from the nozzle for cooling. When the liquid nitrogen is supplied, the wafer is cooled to be at not more than the dew point temperature of peripheral air, so that moisture is condensed on the surface of the wafer. Then, the resist liquid is applied onto the surface of the wafer (S4). COPYRIGHT: (C)2008,JPO&INPIT
|
