| 摘要 |
PROBLEM TO BE SOLVED: To enhance the lifetime effectively by reducing dangling bond effectively through heat treatment control different from conventional one. SOLUTION: The equipment 10 performing heat treatment of a semiconductor processing substrate 1 comprises a treatment container 3 which is heated internally during heat treatment with the semiconductor processing substrate 1 of heat treatment object being arranged therein, a heater 15 for heating the treatment container 3 internally, and a unit 5 for supplying steam into the treatment container 3. The steam supply unit 5 supplies steam into the treatment container 3 such that the partial pressure of steam in the treatment container 3 becomes higher than the ordinary pressure during heat treatment. COPYRIGHT: (C)2008,JPO&INPIT
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