发明名称 CONTACT ARRANGEMENT UNIT
摘要 PROBLEM TO BE SOLVED: To provide a contact arrangement unit, capable of minimizing the space between contacts inserted to a through-hole formed in a plate. SOLUTION: An IC socket 10 comprises a contact 20, in which a first flange part 21b is disposed in a clearance S1 between an upper plate 13 and a middle plate 14x, the first flange part 21 having an outer diameter d2 larger than diameter D2 of an upper through-hole 11a of the upper plate 13, and a second flange part 22b is disposed in a clearance S2 between the middle plate 14y and a lower plate 15, the second flange part 22b having an outer diameter d4 larger than diameter D4 of a lower through-hole 15a of the lower plate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053108(A) 申请公布日期 2008.03.06
申请号 JP20060229490 申请日期 2006.08.25
申请人 ENPLAS CORP 发明人 ODA TAKAHIRO
分类号 H01R33/76;G01R1/06 主分类号 H01R33/76
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