发明名称 |
CHIP FILM PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME |
摘要 |
A chip film package which can achieve a fine pitch and a display panel assembly having the same are provided. The chip film package includes a base film made of an insulating material, a wire pattern formed on the base film to form a predetermined circuit, and a lead which is formed at one end of the wire pattern to be electrically connected to an external terminal, wherein a width (Wb) of the bottom surface of the lead adjacent to the base film is smaller than a width (Wt) of the top surface of the lead connected to the external terminal.
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申请公布号 |
US2008055291(A1) |
申请公布日期 |
2008.03.06 |
申请号 |
US20070838415 |
申请日期 |
2007.08.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG IN-YONG;SON SUN-KYU |
分类号 |
G06F3/038;H01L23/48 |
主分类号 |
G06F3/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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