| 摘要 |
<P>PROBLEM TO BE SOLVED: To inspect the propriety of thickness of a sealing resin by a method other than visual inspection. <P>SOLUTION: A method of inspecting a semiconductor device determines the propriety of the thickness of the side of a resin sealing part of a semiconductor chip by the change of current-voltage characteristics due to photoelectromotive force of the semiconductor chip based on photoirradiation from sideward of the resin sealing part. In reverse directional current-reverse directional voltage characteristics, the method can determines the propriety of the thickness of the resin sealing part by setting a current value based on proper contrast and comparing the size of a threshold and a measured current since the thinner the thickness of the resin sealing is, the larger the current value is. <P>COPYRIGHT: (C)2008,JPO&INPIT |
