发明名称 CONDUCTIVE PASTE AND ALUMINUM NITRIDE SINTERED BODY USING IT, AND BASE BOARD TO MOUNT SEMICONDUCTOR LIGHT EMITTING ELEMENT THEREON USING IT
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive paste in which when a plurality of via holes of different diameters are formed in an aluminum nitride casting body, the conductive paste can be filled into the whole via holes more surely by one-time operation, and when simultaneously calcining this conductive past together with the aluminum nitride formed body, a dent in the upper face of the calcined conductive paste becomes small. <P>SOLUTION: This is the conductive paste filled into the via holes formed in the aluminum nitride formed body, and this is composed by mixing high melting point metal powders, aluminum nitride powders, and a binder, in which the average particle diameter of the high melting point metal powder is 2 &mu;m or less, and in which against 22 to 28 wt.% of the aluminum nitride powder, the high melting point powder is blended by 78 to 72 wt.%. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008052944(A) 申请公布日期 2008.03.06
申请号 JP20060225898 申请日期 2006.08.22
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 OGAMI AYAFUMI
分类号 H01B1/22;H01L23/13;H01L33/62;H05K1/11;H05K3/12;H05K3/40 主分类号 H01B1/22
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