发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device and a method for manufacturing the same are disclosed. The embodiment improves a snapback breakdown voltage and preventing a phenomenon of dashed curves, by forming a gate to be overlapped with first and second drift regions and first and second regions formed in source and drain regions.
申请公布号 US2008054355(A1) 申请公布日期 2008.03.06
申请号 US20070896039 申请日期 2007.08.29
申请人 DONGBU HITEK CO., LTD. 发明人 JANG DUCK KI
分类号 H01L29/94;H01L21/336 主分类号 H01L29/94
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