| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by preventing chipping in the case of the intrusion and dicing of moisture to a semiconductor element. SOLUTION: This semiconductor device is provided with: a semiconductor substrate 13 including an element formation region 2, and a guard ring region 1 positioned so that the element formation region 2 can be surrounded; at least one semiconductor element 40 formed in the element formation region 2 of the semiconductor element 13; and a guard ring structure configured of a metallic layer 11 brought into contact with a first main face 13t of the semiconductor substrate, and installed so that the element formation region 2 can be surrounded in the guard ring region 1. The metallic layer 11 includes a plurality of thin wires 11a and 11b arrayed from the element formation region 2 side to the outside in the guard ring region 1, and the number of the plurality of thin wires arranged so as to be adjacent to at least one of a plurality of side faces specifying the outer shape of the semiconductor substrate 13 is set so as to be made different from the number of the plurality of thin wires arranged so as to be adjacent to at least one of the other side faces. COPYRIGHT: (C)2008,JPO&INPIT |
