| 摘要 |
A bonding structure of panel and back-plate is made by coarsening the surface of the rear plane of silicon die, and then the LCoS panel may bond with the back-plate module more tightly. The coarse structure increases contact surface when bonding the back-plate module with the LCoS panel, as a result of increasing stickiness on both and reducing manufacturing process defects caused by position shifting between the back-plate module and LCoS panel, and solving the position problem before the bonding of the LCoS panel with the back-plate module.
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