| 摘要 |
A printed circuit board connection structure allowing facilitated connection of a plurality of printed circuit boards and cost reduction, a high-frequency unit, a method of connecting printed circuit boards, and a method of manufacturing a high-frequency unit are provided. A printed circuit board connection structure includes a plurality of printed circuit boards, having a connection portion pattern, formed on a surface, and at least one printed circuit board out of the plurality of printed circuit boards, is arranged with respect to another printed circuit board such that the connection portion patterns, are opposed to each other. In addition, the opposing connection portion patterns, are connected to each other by means of a reflow-hardened solder.
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