发明名称 Circuitized substrate with increased roughness conductive layer as part thereof
摘要 A circuitized substrate with a conductive layer which assures enhanced adhesion of the layer to selected dielectric layers used to form the circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer.
申请公布号 US2008054476(A1) 申请公布日期 2008.03.06
申请号 US20070976629 申请日期 2007.10.26
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 EGITTO FRANK D.;KRASNIAK STEPHEN;LAUFFER JOHN M.;MARKOVICH VOYA R.;MATIENZO LUIS J.
分类号 H01L23/52;H01L21/44 主分类号 H01L23/52
代理机构 代理人
主权项
地址