| 摘要 |
Chip arrangement and method for producing a chip arrangement A chip arrangement comprises a first chip with an electrically operable structure on an active surface of the first chip. The first chip is applied on a carrier area in order to make electrical contact with the electrically operable structure via the carrier area. A second chip has a cutout and is arranged on the carrier area, the first chip being arranged in a cavity formed by the cutout and the carrier area.
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