| 摘要 |
A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations. |
