| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacturing method of the same, capable of easily releasing a collet chuck from the semiconductor device upon handling the semiconductor device having a bump employing the collet chuck. SOLUTION: The contact area between the bump and the collet chuck is reduced by forming recesses and projections on the surface of the bump. As the forming method of the recesses and projections, there is a method of pressing a surface roughing jig against the bump, and another method of heating the bump to a temperature higher than the melting point and melting the same to generate recesses and projections on the surface of the bump. COPYRIGHT: (C)2008,JPO&INPIT
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