发明名称 LIQUID PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a liquid processing apparatus capable of making the footprint small and uniformly exhausting air over complete periphery of an exhaust cup without requiring provision of a special isolation mechanism for isolating exhaust and drain. SOLUTION: In a liquid processing apparatus, an annular drain cup 51 is provided so that a rotation cup 4 is configured to rotate a wafer W in a unified manner and the outside of the rotation cup 4 is surrounded. Further, an exhaust cup 52 is concentrically provided so that the exhaust cup 52 incorporates the drain cup 51, and an air current adjustment mechanism 99a and 97 for adjusting an air current is provided so that the air current of a gas component taken into the exhaust cup 52 flows from almost complete periphery toward an exhaust opening 70. The liquid processing apparatus carries out a liquid treatment with supplying a treatment liquid to the wafer W. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008053690(A) 申请公布日期 2008.03.06
申请号 JP20070156158 申请日期 2007.06.13
申请人 TOKYO ELECTRON LTD 发明人 ITO KIKO
分类号 H01L21/304;B05C11/10;H01L21/027;H01L21/306 主分类号 H01L21/304
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