| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is improved in strength of bonding to a mounting board. SOLUTION: At least a pair of grooves 3 are formed in a flank of an external connection lead led out of a resin package 2, and then surface area wetted with solder used for bonding to the mounting board becomes large to improve the strength of bonding to the mounting board. Further, when a lead frame is shaped, holes are formed first overlapping with portions of flanks of external connection leads. Then while a copper plate 10 is punched partially including the holes to form connections of leads, V-shaped grooves are formed in lead flanks, thereby reducing the stress to the leads. COPYRIGHT: (C)2008,JPO&INPIT
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