| 摘要 |
PROBLEM TO BE SOLVED: To perform heating capable of controlling dependency of lay out of temperatures at the time of rapid heating of a substrate, on which an element was formed on a front face. SOLUTION: The lamp heating device 1 for heating a wafer S, as an heating object, in which a predetermined element is formed on the front face side, includes heating lamps 11, 12 arranged on both front and rear sides of the wafer S, and a lamp shield 20 which is arranged at the front face side of the wafer S in a state of surrounding the front face and side face of the wafer S. Through this lamp shield 20, radiant heat is effectively transmitted to the front face of the wafer S while light is absorbed from the heating lamp 11 arranged on the front face side of the wafer S. COPYRIGHT: (C)2008,JPO&INPIT
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